iPhone rumor roundup: Asian sources claim we’ll see thinner phones, more powerful chips & bigger cameras

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A trio of new rumors from a handful of Asian sources have popped up over the holiday and today, each predicting a different facet of the upcoming ‘iPhone 6S‘. While these are still just very unverified whispers at the moment, odds are that at least one of these will end up coming at least partially true.

Here’s a roundup of the latest iPhone rumors, in no particular order:

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Three years later, DigiTimes still insists Apple will ditch Samsung for TSMC

tsmc-560x369-560x300A report out of DigiTimes this morning claims that TSMC has reached a deal with Apple to supply 20nm, 16nm and 10nm chips for future Apple devices. However, as is often the case with DigiTimes, there are a few causes for concern surrounding the report. Leaving the site’s track record on other rumors aside, we must point out that rumors of TSMC supplying chips for Apple’s device are nothing new. In fact, DigiTimes itself reported back in 2011 that Apple would tap the Taiwan Semiconductor Manufacturing Company in a move away from its long-time supplier and biggest rival Samsung. Needless to say, it hasn’t happened yet, and there’s no proof as of yet to back up follow up reports from last year claiming Apple entered an agreement with the company. DigiTimes isn’t even the first to report it this year: Read more