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iPhone 5s & 5c get first teardowns revealing fingerprint sensor assembly & new components

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With Australia, alongside other countries in Asia included in the initial September 20 iPhone launch, the first to get their hands on the iPhone 5s and iPhone 5c, a repair company in the country has just posted the first teardown of the two new iPhones. The iExperts Team out of Australia has taken apart both devices, revealing new components but not yet giving us a look at what we expect will be a Samsung made A7 chip.

The first thing noticed in the teardown was a new connector for the TouchID fingerprint sensor assembly. Lining up with leaks leading up to the launch of the iPhones, it also found a 5.92Whr battery in the 5s (up from 5.45Whr in the iPhone 5), and a 5.73Whr battery in the iPhone 5c. Internal layouts for the two new iPhones also seem to line up with part leaks we seen in recent months. Interestingly, the site notes that the batteries are stamped with “Apple Japan.”

Many of the teardown shots below also include an iPhone 5 next to the 5s and 5c for comparison.


iExperts notes that Apple has fixed an issue from previous generation devices by adding an extra coating to switches “that should help hold them together to prevent the failures prevalent in the other models.”

We don’t learn much more from the teardown, which is likely still in progress as the site analyzes new internal components, but we’ll be learning a lot more as others pry into their new iPhones in the hours ahead. The teardown also gives us a good look at Apple’s new home button/fingerprint assembly:
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First Pebble teardown claims watch is unrepairable, lacks Bluetooth 4.0 support (Update: Pebble responds)

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Update: We’ve received information directly from Pebble that the watch does indeed support Bluetooth 4.0. The company provided the following explanation regarding iFixit’s findings:

The Bluetooth chips TI sent to Panasonic were labeled CC2560 but have been flashed with the firmware (and BT LE support) of a CC2564. That’s why the module was labeled PAN1316. Many chip vendors make silicon consistent between product lines but simply flash different firmware to enable features. Our chips were labeled CC2560 because TI asked us if we wouldn’t mind using them with CC2564 firmware to speed up our order. Pebble most definitely has Bluetooth LE support, though it has not yet been enabled in our operating system.

iFixit has performed its usual teardown process for yet another device today, this time giving us a look inside the recently launched Pebble Bluetooth smart watch. iFixit admits it has no way of rating the repairability of this type of device, and for that reason isn’t giving it a repairability score like usual. Unfortunately, at first glance the watch doesn’t appear to be easily repairable with the report noting waterproofing makes for a “very inaccessible battery.” iFixit noted that excessive adhesive used to keep out water made it impossible to access the insides of the device “without compromising the display”:

The Pebble employs tons of adhesive to keep water (and tinkerers) out. Add in a bezel around the screen, and it’s impossible to separate the cases without compromising the display.

The report also claimed that the Bluetooth chip being used does not appear to support Bluetooth 4.0 (BLE), despite the company promising support for the protocol in a future software update:

The backside of the motherboard houses a Panasonic RF module, promising both Bluetooth and Bluetooth Low Energy (BLE) functionality, as advertised by the folks at Pebble. Removing the EMI shield reveals a Texas Instruments chip in the same family as, but slightly different than the one we expected. According to its datasheet, this chip doesn’t support BLE. Word on the street was that Pebble had BLE functionality just waiting to be activated with a firmware update, but we can’t find evidence of the hardware to back up this hidden potential.

The good news is iFixit estimates the battery in Pebble will last 6 to 10 years and the developers confirmed a recycling program will be in place. We’ll have to wait for official word from Pebble on the questioned Bluetooth 4.0 support. You can check out the full teardown from iFixit here.

New Mac minis get first tear down and Geekbench scores

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Apple’s refreshed Mac mini lineup already received some nice RAM upgrade options from OWC this morning, but now we get a look at the insides of the updated Macs courtesy of a tear down from Mac Mini Vault. The website also published Geekbench scores for the device, showing some impressive performance increases over the 2011 models.

First off, it found minimal changes to packaging and the positioning of the new Mac mini’s internals:

The overall packaging size was unchanged, however marketing specs have been updated and the inside organization has been optimized… Under the hood only minor differences are visible. Most notable are the fan design, Hitachi hard drive, and connections for the antennas. (2012 on left – 2011 on right)

As for Geekbench, the new stock Mac minis were able to record a score of 7433 running 10.8.1 out of the box. In comparison, Mac Mini Vault had a 2011 Mac mini running 10.8.2 clocked at 6583. Mac Mini Vault also noted it will begin testing alternative OS options for the new Mac mini server edition next week:


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iFixit tears down the new Apple TV- two antennas, single-core A5 chip, and Broadcom 4330 chip

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Following the first teardown of the new Apple TV over the weekend at XBMC.org, we get some more details from yet another teardown. They already gave the new iPad the teardown treatment, and now our friends over at iFixit ripped apart the third-generation Apple TV giving it an 8 out of 10 reparability score. The report revealed the device now has two antennas instead of one, which iFixit noted: “Apple added the new antenna to address complaints about range and signal strength.” It also discovered a Broadcom 4330 chip (same as the new iPad) with support for dual-band 2.4 GHz and 5GHz 802.11 a/b/g/n, as well as a new single-core A5 processor. iFixit noticed the new design does not rely on a thermal cooling pad, which could mean the new single-core CPU does not run as hot as earlier generations.

The chips inside:


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