The WSJ reports on the next generation iPhone due this fall:
According to some suppliers of components to Apple, the new version of the iPhone is expected to be thinner and lighter than the iPhone 4 and sport an 8-megapixel camera. One person said the new iPhone will operate on Qualcomm Inc.’s wireless baseband chips. The current iPhone 4 uses memory chips made by Samsung Electronics Co. and baseband chips from German chip maker Infineon Technologies AG, according to a report by market-research firm iSuppli Corp.
Verizon execs have already said the next iPhone will be a GSM/CDMA world phone – which means it is likely that it will use Qualcomm’s Gobi chips (As the current Verizon iPhone and iPad currently do). Numerous reports have also said it will contain a 8megapixel camera – from Sony and other manufacturers.
There is some question about whether or not these devices will meet production deadlines, however…