UPDATE: Qualcomm at Mobile World Congress in Barcelona, Spain took the wraps off three next-generation modem chipsets, first to support 84MBps HSPA+ Release 10 and LTE-Advanced with carrier aggregation technology.
Chipmaker Qualcomm today issued a press release highlighting a fifth iteration of its Gobi reference platform that had actually been introduced back in February 2011. That said, these chips include in a comprehensive support for TD-SCDMA, TD-LTE, LTE on FDD and TDD networks worldwide, in addition to embedded GPS capability.
Of course, the platform also supports the usual HSPA+ and EV-DO for backwards compatibility and (unlike current 6000 series chips) voice. Such a powerful combo in theory allows Gobi products to connect to the faster LTE network locally and stay connected to the Internet globally on 3G networks worldwide.
Now, Qualcomm noted in the release included after the break that both the MDM9615 and MDM9215 work with Windows 8 and Android devices plus x86 and Qualcomm’s own dual- and quad-core Snapdragon system-on-a-chip solutions. For all we know, this could be the chip inside the iPhone 5. The yet-to-be-announced iPhone 5 running this new Gobi chip would theoretically enable Apple to tap a single hardware in targeting a variety of carriers that often use different and incompatible radio technologies.
This includes the world’s biggest carrier China Mobile whose infrastructure revolves around TD-LTE radio technology. Put simply: These Gobi chips allow for true world-phone compatibility. It is worth noting that almost every 3G iOS device since the Verizon iPhone uses Qualcomm’s Gobi platform. The only exception is the AT&T iPad that still runs an older Infineon chip. Whichever way you look at it, one thing is certain: Apple will soon ship its first 4G LTE mobile device.