One of the main upgrades to the next iPhone’s internals will be a redesigned wireless system featuring a new Qualcomm-made LTE chip, as revealed by images of a prototype iPhone 6S logic board shared by a source. As shown in the image below, the new device will include Qualcomm’s MDM9635M chip, also known as the ‘9X35’ Gobi modem platform. This new chip promises significant performance improvements over the “9X25” chip found inside of the current iPhone 6 and iPhone 6 Plus, capable of delivering up to twice the theoretical LTE download speeds…

expand full story