Apple begins testing TSMC A6 processor with 28-nanometer process, coming Q2 next year

Taiwan Economic News is reporting that local Taiwan Semiconductor Manufacturing Co., Ltd (TSMC), the company slated to supply Apple with the A6 processor after a shift from Samsung, has begun trials of the new chip made with the company’s “newest 28-nanometer process and 3D stacking technologies”. However, dont expect to see the A6 in a new iteration of the iPad anytime soon, as the report suggests the processor wont be officially unveiled until Q2 of next year, at the earliest.

Included in the report:

TSMC has applied its newest 28-nanometer process and 3D stacking technologies to produce the next-generation processor A6, which is based on the ARM architecture and will undergo TSMC’s cutting-edge silicon interposer and bump on trace (BOT) methodologies. Industry insiders said that the manufacturing will help to pump considerable momentum into TSMC’s business growth starting next year, though the company has yet to comment on the deal for the moment.

This contradicts an earlier report thru Reuters which stated that test production had already begun in July.  Both reports agreed that the final A6 processors would be complete and ready for iPad 3 in early 2012.  EETimes had reported the move back in March which was said to involve Apple’s current A5 chip but that never materialized.

An Apple switch to TSMC would obviously be a huge blow to ‘frenemy’ Samsung who currently makes the iPad CPU, DRAM and supplies Flash storage as well.

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