A report from Korea’s ETnews claims that Apple will be applying Electro Magnetic Interference (EMI) shielding to a number of individual chips in the iPhone 7, to reduce electromagnetic interference. This would be a step up from Apple’s current approach of applying shielding to the circuit board as a whole, though it did apply shielding to the S1 chip used in the Apple Watch.
“As clock signals of digital chips have increased and as diverse functions such as 3D-touch and others have recently added, reduction of electromagnetic waves have emerged as major topic of this industry.” said a representative of this industry.
While unattributed, the report appears to originate from one of the Korean companies said to be in line to carry out the shielding work, StatsChipPac and Amkor. Given that the piece talks-up prospects for companies involved in the business, we’re chalking it up as an unverified claim.
Taiwan’s TSMC is said to be in line to be the sole supplier of A10 chips for the iPhone 7, while a report today claims that Wistron will be added to Apple’s existing assembler roster of Foxconn and Pegatron.
Via Patently Apple
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This will likely be important for their distance charging prospects. You can look at things Apple does as necessary steps, for example they introduce Touch ID in the iPhone 5s, knowing that they are working on Apple Pay. And want Touch ID to be well known and improve on the technology before Apple Pay in the iPhone 6. The iPhone 6s added Touch ID and that will likely play a future role in removing the home button. In the iPhone 7 they may be changing the case material and shielding chips from magnetic wave interference in anticipation of possible wireless distance charging being the staple feature of the iPhone 7s.
iPhone 6s added 3D Touch**
John Snow? Is that you?