iPhone 6S to double LTE speeds, run more efficiently with new Qualcomm chip

9to5Mac_6S3

One of the main upgrades to the next iPhone’s internals will be a redesigned wireless system featuring a new Qualcomm-made LTE chip, as revealed by images of a prototype iPhone 6S logic board shared by a source. As shown in the image below, the new device will include Qualcomm’s MDM9635M chip, also known as the ‘9X35′ Gobi modem platform. This new chip promises significant performance improvements over the “9X25″ chip found inside of the current iPhone 6 and iPhone 6 Plus, capable of delivering up to twice the theoretical LTE download speeds…

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Three years later, DigiTimes still insists Apple will ditch Samsung for TSMC

tsmc-560x369-560x300A report out of DigiTimes this morning claims that TSMC has reached a deal with Apple to supply 20nm, 16nm and 10nm chips for future Apple devices. However, as is often the case with DigiTimes, there are a few causes for concern surrounding the report. Leaving the site’s track record on other rumors aside, we must point out that rumors of TSMC supplying chips for Apple’s device are nothing new. In fact, DigiTimes itself reported back in 2011 that Apple would tap the Taiwan Semiconductor Manufacturing Company in a move away from its long-time supplier and biggest rival Samsung. Needless to say, it hasn’t happened yet, and there’s no proof as of yet to back up follow up reports from last year claiming Apple entered an agreement with the company. DigiTimes isn’t even the first to report it this year: Read more