French website Nowhereelse [translated
] posted more part leaks for the next-generation iPhone this morning, and while we get a new glimpse at the front screen, neither of the pictures show anything terribly new. The bronze piece pictured was originally thought to be an NFC chip
, but more conventional wisdom suggests it is a speaker for the headset.
We also received an image of 4 iPhone motherboards before being chip loaded:
…And, perhaps our most sketchy image:
Adding to the slew of alleged leaks, a new image of a purported logic board for the next-generation iPhone has surfaced. The crisp picture shows the logical board without any protective EMI shielding for an internal look at the A6 chip that supposedly sits inside. We are a bit wary about the authenticity of this picture, as its originator, Sonny Dickson, said it needed to be “enhanced with Photoshop.”
It is speculated the A6, or a variant of the A5X chip, would appear in the next iPhone, and many thought Taiwanese Semiconductor Manufacturing Company’s 28nm process would manufacturer the quad-core chip, but the latest reports claimed Apple is stuck with Samsung for at least CPU and/or baseband chip building after TSMC rebuffed an exclusive bid.
We also see another 9-pin dock cable from Sonny below:
A gallery of new parts is below—including a video from Sinocent. Read more