Photos of apparent leaked iPhone 6 parts continue, the latest from AppleClub in Taiwan claiming to show complete logic board assemblies. With most of the components hidden beneath shielding, we don’t learn anything new beyond the flash memory chip middle-left appearing to be made by Toshiba …
The A8 chip would be beneath the shielding on the right, just above the SIM slot.
The photo adds to recent ones showing tapered edges on the display panel and the power button moved from the top to the side of the phone; a raised camera cutout; and a single, circular True Tone flash.
The iPhone is expected to be officially announced by Apple on 9th September.
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