We’re still just over two weeks away from the anticipated iPhone 6 event reportedly scheduled for September 9th where Apple is expected to debut the next generation of iPhone hardware including a more powerful, efficient A8 system-on-a-chip.

Worry not, though, about the next, next generation iPhone rumors, Apple watchers, as a report from Chinese publication Economic Daily News (via Digitimes) shares that TSMC, or Taiwan Semiconductor Manufacturing Company, plans to “advance volume production on its 16nm process” during the beginning of 2015 “with monthly output of 50,000 wafers” to deliver Apple’s A9 system-on-a-chip.

The report notes TSMC previously planned to begin 16nm volume production during the second quarter of next year.

The Wall Street Journal reported earlier this summer that TSMC would make good on a contract and begin shipping the iPhone 6’s A8 processor using a 20nm process.

A later report pointed to Samsung’s dropped profits around the SoC (system-on-a-chip) division due to Apple opting for TSMC producing the A8 rather than sticking with Samsung.

As for the A8 chip powering the iPhone 6 expected to debut in just a few weeks, 9to5Mac reported this in May:

Sources also say that Apple has developed a new A8 system-on-a-chip for the next iPhone that focuses on marginal speed improvements rather than core architectural changes, but adds significant performance and efficiency enhancements in order to improve the iPhone’s battery life.