Following a number of leaks claiming to show prototypes, cases, and manufacturing tools for the next-generation iPhone, today yet another leak of a physical iPhone 6 mockup has popped up via Japanese blog Macotakara.jp. The site posted images from the Hong Kong Electronics Fair taking place from April 13-16 that apparently show mockups of the iPhone 6 used by case makers to create cases and accessories they plan to launch alongside the new iPhone. Read more
The State of Arizona today announced that Apple is planning to build a new manufacturing facility in the city of Mesa, Arizona. The facility will create 700 jobs for manufacturing, and an additional 1,300 jobs for the construction and management of the new facility, In total, Apple will be bringing at least 2,000 new jobs to the United States thanks to this new facility.
In addition to the manufacturing facility, Apple will be constructing a new solar power grid in the city to power the manufacturing operations, according to Arizona’s announcement:
With the lower-cost iPhone supposedly already in production, in time for launch later this year, the likelihood of parts leaking can only increase. Earlier today, iPhone5skopen posted images of supposed front panels for the cheaper device. As shown by previous leaks, the faceplate is almost identical to an iPhone 5 with a plastic body being the main differentiating factor in the product lineup.
Now, Chinese site IT168 has posted pictures of supposed camera modules for this device (via MacRumors). The site claims the sensor is the same as the one found in the iPhone 5, being 8 megapixels in resolution, albeit in a plastic casing. The inclusion of an eight megapixel sensor, rather than a five megapixel one as some expect, gives more weight to the idea this device is by no means a “budget” product. Recent reports have put the ‘cheap’ iPhone in a mid-range price bracket, around $350.
We also received an image of 4 iPhone motherboards before being chip loaded:
…And, perhaps our most sketchy image:
Adding to the slew of alleged leaks, a new image of a purported logic board for the next-generation iPhone has surfaced. The crisp picture shows the logical board without any protective EMI shielding for an internal look at the A6 chip that supposedly sits inside. We are a bit wary about the authenticity of this picture, as its originator, Sonny Dickson, said it needed to be “enhanced with Photoshop.”
It is speculated the A6, or a variant of the A5X chip, would appear in the next iPhone, and many thought Taiwanese Semiconductor Manufacturing Company’s 28nm process would manufacturer the quad-core chip, but the latest reports claimed Apple is stuck with Samsung for at least CPU and/or baseband chip building after TSMC rebuffed an exclusive bid.
We also see another 9-pin dock cable from Sonny below:
A gallery of new parts is below—including a video from Sinocent. Read more